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1

4H-SiC: a material for high temperature Hall sensor

Jean-Louis Robert, Sylvie Contreras, Jean Camassel, Julien Pernot, Eric Neyret, Léa Di Cioccio, Thierry Billon

Journal:

Sensors and Actuators A: Physical

Année:

2002

Langue:

english

Fichier:

PDF, 186 KB

english, 2002

2

Electrical transport in n-type 4H silicon carbide

Pernot, J., Zawadzki, W., Contreras, S., Robert, J. L., Neyret, E., Di Cioccio, L.

Journal:

Journal of Applied Physics

Année:

2001

Langue:

english

Fichier:

PDF, 305 KB

english, 2001

3

3D harnessing of light with 2.5D photonic crystals

P. Viktorovitch, B. Ben Bakir, S. Boutami, J. Louis Leclercq, X. Letartre, P. Rojo-Romeo, C. Seassal, M. Zussy, L. Di Cioccio, J.Marc Fedeli

Journal:

Laser & Photonics Reviews

Année:

2010

Langue:

english

Fichier:

PDF, 751 KB

english, 2010

4

Modeling and simulation of SiC CVD in the horizontal hot-wall reactor concept

J. Meziere, M. Ucar, E. Blanquet, M. Pons, P. Ferret, L. Di Cioccio

Journal:

Journal of Crystal Growth

Année:

2004

Langue:

english

Fichier:

PDF, 638 KB

english, 2004

5

InP dies transferred onto silicon substrate for optical interconnects application

M. Kostrzewa, L. Di Cioccio, M. Zussy, J.C. Roussin, J.M. Fedeli, N. Kernevez, P. Regreny, Ch. Lagahe-Blanchard, B. Aspar

Journal:

Sensors and Actuators A: Physical

Année:

2006

Langue:

english

Fichier:

PDF, 257 KB

english, 2006

6

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - First integration of Cu TSV using die-to-wafer direct bonding and planarization

Leduc, Patrick, Assous, Myriam, Di Cioccio, Lea, Zussy, Marc, Signamarcheix, Thomas, Roman, Ant, Rousseau, Maxime, Verrun, Sophie, Bally, Laurent, Bouchu, David, Cadix, Lionel, Farcy, Alexis, Sillon,

Année:

2009

Langue:

english

Fichier:

PDF, 753 KB

english, 2009

7

Low temperature direct bonding: An attractive technique for heterostructures build-up

H. Moriceau, F. Rieutord, F. Fournel, L. Di Cioccio, C. Moulet, L. Libralesso, P. Gueguen, R. Taibi, C. Deguet

Journal:

Microelectronics Reliability

Année:

2012

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2012

8

Coupling analysis of heterogeneous integrated InP based photonic crystal triangular lattice band-edge lasers and silicon waveguides

Hattori, Haroldo T., Seassal, Christian, Letartre, Xavier, Rojo-Romeo, Pedro, Leclercq, Jean L., Viktorovitch, Pierre, Zussy, Marc, di Cioccio, Lea, El Melhaoui, Loubna, Fedeli, Jean-Marc

Journal:

Année:

2005

Langue:

english

Fichier:

PDF, 376 KB

english, 2005

9

Electrically pumped InP-based microdisk lasers integrated with a nanophotonic silicon-on-insulator waveguide circuit

Van Campenhout, J., Rojo Romeo, P., Regreny, P., Seassal, C., Van Thourhout, D., Verstuyft, S., Di Cioccio, L., Fedeli, J.-M., Lagahe, C., Baets, R.

Journal:

Année:

2007

Langue:

english

Fichier:

PDF, 2.48 MB

english, 2007

10

Milliwatt-level fiber-coupled laser power from photonic crystal band-edge laser

Kim, Sunghwan, Ahn, Sungmo, Lee, Jeongkug, Jeon, Heonsu, Regreny, Philippe, Seassal, Christian, Augendre, Emmanuel, Di Cioccio, Lea

Journal:

Année:

2011

Langue:

english

Fichier:

PDF, 945 KB

english, 2011

11

InP/InGaAs Photodetector on SOI Photonic Circuitry

Binetti, P.R.A., Leijtens, X.J.M., de Vries, T., Oei, Y.S., Di Cioccio, L., Fedeli, J.-M., Lagahe, C., Van Campenhout, J., Van Thourhout, D., van Veldhoven, P.J., Nötzel, R., Smit, M.K.

Journal:

IEEE Photonics Journal

Année:

2010

Langue:

english

Fichier:

PDF, 911 KB

english, 2010

12

Heterogeneous integration of microdisk lasers on silicon strip waveguides for optical interconnects

H.T. Hattori, C. Seassal, E. Touraille, P. Rojo-Romeo, X. Letartre, G. Hollinger, P. Viktorovitch, L. Di Cioccio, M. Zussy, L.E. Melhaoui, J.M. Fedeli

Journal:

IEEE Photonics Technology Letters

Année:

2006

Langue:

english

Fichier:

PDF, 262 KB

english, 2006

13

InP-Based Membrane Couplers for Optical Interconnects on Si

Binetti, P., Orobtchouk, R., Leijtens, X., Bing Han, de Vries, T., Yoki-Siang Oei, Di Cioccio, L., Fedeli, J.-M., Lagahe, C., van Veldhoven, P.J., Notzel, R., Smit, M.K.

Journal:

IEEE Photonics Technology Letters

Année:

2009

Langue:

english

Fichier:

PDF, 218 KB

english, 2009

14

A Compact SOI-Integrated Multiwavelength Laser Source Based on Cascaded InP Microdisks

Van Campenhout, J., Liu Liu, Romeo, P.R., Van Thourhout, D., Seassal, C., Regreny, P., Di Cioccio, L., Fedeli, J.-M., Baets, R.

Journal:

IEEE Photonics Technology Letters

Année:

2008

Langue:

english

Fichier:

PDF, 226 KB

english, 2008

15

Low-Footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-Based Microdisk Lasers and Microdetectors

Van Campenhout, J., Binetti, P.R.A., Romeo, P.R., Regreny, P., Seassal, C., Leijtens, X.J.M., de Vries, T., Yoki Siang Oei, van Veldhoven, R.P.J., Notzel, R., Di Cioccio, L., Fedeli, J.-M., Smit, M.K.

Journal:

IEEE Photonics Technology Letters

Année:

2009

Langue:

english

Fichier:

PDF, 305 KB

english, 2009

16

[IEEE 2009 6th IEEE International Conference on Group IV Photonics (GFP) - San Francisco, CA, USA (2009.09.9-2009.09.11)] 2009 6th IEEE International Conference on Group IV Photonics - InP/InGaAs photodetector on SOI circuitry

Binetti, P.R.A., Leijtens, X.J.M., de Vries, T., Oei, Y.S., Di Cioccio, L., Fedeli, J.-M., Lagahe, C., Van Campenhout, J., Van Thourhout, D., van Veldhoven, P.J., Notzel, R., Smit, M.K.

Année:

2009

Langue:

english

Fichier:

PDF, 223 KB

english, 2009

17

Direct bonding of titanium layers on silicon

F. Baudin, L. Di Cioccio, V. Delaye, N. Chevalier, J. Dechamp…

Journal:

Microsystem Technologies

Année:

2013

Langue:

english

Fichier:

PDF, 714 KB

english, 2013

18

Mechanisms of copper direct bonding observed by in-situ and quantitative transmission electron microscopy

Martinez, M., Legros, M., Signamarcheix, T., Bally, L., Verrun, S., Di Cioccio, L., Deguet, C.

Journal:

Thin Solid Films

Année:

2013

Langue:

english

Fichier:

PDF, 587 KB

english, 2013

19

[IEEE 2007 IEEE International Conference on Integrated Circuit Design and Technology - Austin, TX, USA (2007.05.30-2007.06.1)] 2007 IEEE International Conference on Integrated Circuit Design and Technology - Enabling technologies for 3D System on Chip (SoC) integration and examples of 3D integrated structures

Charlet, Barbara, Di Cioccio, Lea, Leduc, Patrick

Année:

2007

Langue:

english

Fichier:

PDF, 569 KB

english, 2007

20

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low temperature metal bonding for 3D and power device packaging

Di Cioccio, L., Beilliard, Y., Mermoz, S., Estevez, R., Coudrain, P., Moreau, S., Widiez, J.

Année:

2014

Langue:

english

Fichier:

PDF, 282 KB

english, 2014

21

Free electron density and mobility in high-quality 4H–SiC

Pernot, J., Contreras, S., Camassel, J., Robert, J. L., Zawadzki, W., Neyret, E., Di Cioccio, L.

Journal:

Applied Physics Letters

Année:

2000

Langue:

english

Fichier:

PDF, 303 KB

english, 2000

22

[IEEE Technology (ICICDT) - Grenoble, France (2010.06.2-2010.06.4)] 2010 IEEE International Conference on Integrated Circuit Design and Technology - 3D integration: Advantages, enabling technologies & applications

Sadaka, Mariam, Radu, Ionut, Di Cioccio, Lea

Année:

2010

Langue:

english

Fichier:

PDF, 284 KB

english, 2010

23

[IEEE 2007 4th IEEE International Conference on Group IV Photonics - Tokyo (2007.09.19-2007.09.21)] 2007 4th IEEE International Conference on Group IV Photonics - InP-based Membrane Photodetectors for Optical Interconnects to Si

Binetti, P.R.A., Leijtens, X.J.M., Nikoufard, M., de Vries, T., Oei, Y.S., Di Cioccio, L., Fedeli, J.-M., Lagahe, C., Orobtchouk, R., Seassal, C., Van Campenhout, J., Van Thourhout, D., van Veldhoven,

Année:

2007

Langue:

english

Fichier:

PDF, 1009 KB

english, 2007

24

In-situ deposition and processing of YBa/sub 2/Cu/sub 3/O/sub 7-x/ films and multilayers for optoelectronic devices

Villegier, J.C., Moriceau, H., Boucher, H., Chicault, R., Di Cioccio, L., Jager, A., Schwerdtfeger, M., Vabre, M., Villard, C.

Journal:

IEEE Transactions on Magnetics

Année:

1991

Langue:

english

Fichier:

PDF, 549 KB

english, 1991

25

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Di Cioccio, L., Gueguen, P., Taibi, R., Landru, D., Gaudin, G., Chappaz, C., Rieutord, F., de Crecy, F., Radu, I., Chapelon, L. L., Clavelier, L.

Journal:

Journal of The Electrochemical Society

Année:

2011

Langue:

english

Fichier:

PDF, 1.58 MB

english, 2011

26

Intrinsic Mobility of Conduction Electrons in 4H-SiC

Pernot, Julien, Contreras, Sylvie, Neyret, E., Di Cioccio, Lea, Zawadzki, W., Robert, Jean-Louis

Journal:

Materials Science Forum

Année:

2001

Fichier:

PDF, 346 KB

2001

27

SiC In-Situ Pre-Growth Etching: A Thermodynamic Study

Neyret, E., Di Cioccio, Lea, Blanquet, Elisabeth, Raffy, C., Pudda, C., Billon, Thierry, Camassel, Jean

Journal:

Materials Science Forum

Année:

2000

Langue:

english

Fichier:

PDF, 327 KB

english, 2000

28

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Robustness and reliability achievements for direct hybrid bonding integration: a review

Moreau, S., Jourdon, J., Lhostis, S., Bouchu, D., Henrion, Y., Arnaud, L., Jouve, A., Balan, V., Fournel, F., Lamontagne, P., Cheramy, S., Cioccio, L. Di

Année:

2019

Langue:

english

Fichier:

PDF, 175 KB

english, 2019

29

Peroxidase-Active Molecular Weight Markers for Direct Detection in Western Blot

Giovanni Maurizi, Annibale Ciabini, Vito Di Cioccio, Paolo Ruggiero

Journal:

Analytical Biochemistry

Année:

2000

Langue:

english

Fichier:

PDF, 54 KB

english, 2000

30

Twin free growth of II–VI compounds on (111) CdZnTe substrates by molecular beam epitaxy

L. Di Cioccio, A. Million, J. Piaguet, G. Rolland, G. Lentz, N. Magnea, H. Mariette

Journal:

Journal of Crystal Growth

Année:

1989

Langue:

english

Fichier:

PDF, 481 KB

english, 1989

31

Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration

Pierric Gueguen, Caroline Ventosa, Léa Di Cioccio, Hubert Moriceau, François Grossi, Maurice Rivoire, Patrick Leduc, Laurent Clavelier

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 901 KB

english, 2010

32

YBaCuO-based multilayers for optoelectronic devices

J.C. Villegier, H. Moriceau, H. Boucher, L. Di Cioccio, A. Ghis, A. Jaeger, M. Levis, F. Pourtier, M. Schwerdtfeder, M. Vabre, C. Villard, R. Chicault

Journal:

Materials Science and Engineering: B

Année:

1992

Langue:

english

Fichier:

PDF, 853 KB

english, 1992

33

TEM characterization of high Tc superconductive multilayered thin films

A. Alimoussa, M.J. Casanove, C. Roucau, C. Villard, M. Schwerdtfeger, L. di Cioccio, H. Moriceau, J.C. Villegier

Journal:

Materials Science and Engineering: B

Année:

1992

Langue:

english

Fichier:

PDF, 507 KB

english, 1992

34

Unintentional incorporation of contaminants during chemical vapour deposition of silicon carbide

Stephan Karmann, Léa Di Cioccio, Bruno Blanchard, Thierry Ouisse, Denise Muyard, Claude Jaussaud

Journal:

Materials Science and Engineering: B

Année:

1995

Langue:

english

Fichier:

PDF, 354 KB

english, 1995

35

Prevalence of pain in elderly hospitalized patients

W. Gianni, R.A. Madaio, L. Di Cioccio, F. D’Amico, D. Policicchio, D. Postacchini, F. Franchi, M. Ceci, E. Benincasa, M. Gentili, S.M. Zuccaro

Journal:

Archives of Gerontology and Geriatrics

Année:

2010

Langue:

english

Fichier:

PDF, 180 KB

english, 2010

36

Feasibility of III–V on-silicon strain relaxed substrates

M. Kostrzewa, G. Grenet, P. Regreny, J.L. Leclercq, P. Perreau, E. Jalaguier, L. Di Cioccio, G. Hollinger

Journal:

Journal of Crystal Growth

Année:

2005

Langue:

english

Fichier:

PDF, 642 KB

english, 2005

37

Growth by molecular beam epitaxy of AlGaN/GaN high electron mobility transistors on Si-on-polySiC

Y. Cordier, S. Chenot, M. Laügt, O. Tottereau, S. Joblot, F. Semond, J. Massies, L. Di Cioccio, H. Moriceau

Journal:

Superlattices and Microstructures

Année:

2006

Langue:

english

Fichier:

PDF, 361 KB

english, 2006

38

Study of 4H– and 6H–SiC films grown on off-oriented (0 0 0 1) SiC substrates

V Papaioannou, J Stoemenos, L Di Cioccio, D David, C Pudda

Journal:

Journal of Crystal Growth

Année:

1998

Langue:

english

Fichier:

PDF, 1.01 MB

english, 1998

39

Synchrotron radiation study of Cs/carbon-rich β-SiC(100) and Cs/silicon-rich β-SiC(100) surfaces: metallization and interface formation

F. Semond, P. Soukiassian, P.S. Mangat, Z. Hurych, L. di Cioccio, C. Jaussaud

Journal:

Applied Surface Science

Année:

1996

Langue:

english

Fichier:

PDF, 671 KB

english, 1996

40

Deposition, evaluation and control of 4H and 6H SiC epitaxial layers for device applications

E. Neyret, L. Di Cioccio, J.M. Bluet, J. Pernot, P. Vicente, D. Anglos, M. Lagadas, T. Billon

Journal:

Materials Science and Engineering: B

Année:

2001

Langue:

english

Fichier:

PDF, 159 KB

english, 2001

41

Comparison of the electrical and optical properties of 3C-SiC on SOI from different origin

J.M. Bluet, S. Contreras-Azema, J. Camassel, J.L. Robert, L. Di Cioccio, W. Reichert, R. Lossy, E. Obermeier, J. Stoemenos

Journal:

Materials Science and Engineering: B

Année:

1997

Langue:

english

Fichier:

PDF, 448 KB

english, 1997

42

High temperature ohmic contacts to 3C-SiC grown on Si substrates by chemical vapor deposition

G. Constantinidis, N. Kornilios, K. Zekentes, J. Stoemenos, L. di. Cioccio

Journal:

Materials Science and Engineering: B

Année:

1997

Langue:

english

Fichier:

PDF, 382 KB

english, 1997

43

Silicon carbide on insulator formation by the Smart-Cut® process

L. Di Cioccio, F. Letertre, Y. Le Tiec, A.M. Papon, C. Jaussaud, M. Bruel

Journal:

Materials Science and Engineering: B

Année:

1997

Langue:

english

Fichier:

PDF, 846 KB

english, 1997

44

III-V/Si photonics by die-to-wafer bonding

G. Roelkens, J. Van Campenhout, J. Brouckaert, D. Van Thourhout, R. Baets, P. Rojo Romeo, P. Regreny, A. Kazmierczak, C. Seassal, X. Letartre, G. Hollinger, J.M. Fedeli, L. Di Cioccio, C. Lagahe-Blanc

Journal:

Materials Today

Année:

2007

Langue:

english

Fichier:

PDF, 777 KB

english, 2007

45

III–V layer transfer onto silicon and applications

L. Di Cioccio, E. Jalaguier, F. Letertre

Journal:

physica status solidi (a)

Année:

2005

Langue:

english

Fichier:

PDF, 319 KB

english, 2005

46

Realization of AlGaN/GaN HEMTs on Si-on-polySiC substrates

Yvon Cordier, Sébastien Chenot, Marguerite Laügt, Olivier Tottereau, Sylvain Joblot, Fabrice Semond, Jean Massies, Léa Di Cioccio, Hubert Moriceau

Journal:

physica status solidi (c)

Année:

2007

Langue:

english

Fichier:

PDF, 198 KB

english, 2007

47

Relative Sensitivity of Hyporheic Copepods to Chemicals

W. D. Di Marzio, D. Castaldo, C. Pantani, A. Di Cioccio, T. Di Lorenzo, M. E. Sáenz, D. M. P. Galassi

Journal:

Bulletin of Environmental Contamination and Toxicology

Année:

2009

Langue:

english

Fichier:

PDF, 198 KB

english, 2009

48

Conversion of murine antibodies to human antibodies and their optimization for ovarian cancer therapy targeted to the folate receptor

Mariangela Figini, Franck Martin, Renata Ferri, Elena Luison, Elena Ripamonti, Alberto Zacchetti, Mimosa Mortarino, Vito Di Cioccio, Giovanni Maurizi, Marcello Allegretti, Silvana Canevari

Journal:

Cancer Immunology, Immunotherapy

Année:

2009

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2009

49

X-ray diffraction imaging investigation of silicon carbide on insulator structures

S. Milita, Y. Le Tiec, E. Pernot, L. Di Cioccio, J. Härtwig, J. Baruchel, M. Servidori, F. Letertre

Journal:

Applied Physics A: Materials Science & Processing

Année:

2002

Langue:

english

Fichier:

PDF, 245 KB

english, 2002

50

Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration

B. Charlet, L. Di Cioccio, J. Dechamp, M. Zussy, T. Enot, R. Canegallo, A. Fazzi, R. Guerrieri, L. Magagni

Journal:

Microelectronic Engineering

Année:

2006

Langue:

english

Fichier:

PDF, 1.24 MB

english, 2006